We organize PCB production in accordance with the client's needs and requirements, all we need is the technical parameters we ourselves established or received from the client beforehand. We procure the components required for the production from approved vendors and also prepare the process by creating the stencil and its framework, while following the precursory production documentation all the way through of course. Through-hole and surface-mount devices are both available through manual soldering and we also use state-of-the-art SMT placement equipment as well. We can organize full-scale projects from financial planning to shelf-ready unit and packaging design.

BGA (Ball Grid Array) IC insertion

Pick and Place Machine in work